HBM4 wird bemustert: Micron folgt SK Hynix und kommt Samsung zuvor https://www.computerbase.de/news/arbeitsspeicher/hbm4-wird-bemustert-micron-folgt-sk-hynix-und-kommt-samsung-zuvor.93087/ #Micron #HBM4
Teurer Speicher: HBM4 soll 30 Prozent mehr als HBM3E kosten https://www.computerbase.de/news/arbeitsspeicher/teurer-speicher-hbm4-soll-30-prozent-mehr-als-hbm3e-kosten.92875/ #HBM4
Standard veröffentlicht: HBM4 ist fertig und noch etwas schneller geworden https://www.computerbase.de/news/arbeitsspeicher/standard-veroeffentlicht-hbm4-ist-fertig-und-noch-etwas-schneller-geworden.92293/ #HBM4 #JEDEC
SK hynix lancia la memoria HBM4 a 12 livelli: velocità e capacità senza precedenti per l’AI
SK hynix solidifies HBM market leadership by supplying world's first HBM4 12-layer samples to major customers, including NVIDIA, showcasing unprecedented data processing speeds and capacity for AI applications.
#YonhapInfomax #SKHynix #HBM4 #ArtificialIntelligence #Semiconductor #NVIDIA #Economics #FinancialMarkets #Banking #Securities #Bonds #StockMarket
https://en.infomaxai.com/news/articleView.html?idxno=54743
Anfrage bei SKHynix: Nvidia will früher auf HBM4-Chips mit 1,6 TB/s setzen können https://www.computerbase.de/news/arbeitsspeicher/anfrage-bei-skhynix-nvidia-will-frueher-auf-hbm4-chips-mit-1-6-tb-s-setzen-koennen.90176/ #Nvidia #HBM4 #SKHynix
JEDEC Approaches Finalization of #HBM4 Standard, Eyes Future Innovations
HBM4 is set to introduce a doubled channel count per stack compared to HBM3, with a larger physical footprint
HBM4 will specify 24 Gb and 32 Gb layers, with options for supporting 4-high, 8-high, 12-high and 16-high TSV stacks
The committee has initial agreement on speeds bins up to 6.4 Gbps with discussion ongoing for higher frequencies
TSMC entra nel mercato delle memorie HBM4 e collabora con SK Hynix e Nvidia
https://gomoot.com/tsmc-entra-nel-mercato-delle-memorie-hbm4-e-collabora-con-sk-hynix-e-nvidia/
Samsung e SK Hynix cessano la produzione di memorie DDR3 per soddisfare la domanda di memorie HBM3
SKhynix plans to commence mass production of #HBM3E in 1H2024
#HBM4 is set for sampling in 2025 and mass production in 2026
https://xiaomitoday.com/sk-hynix-unveils-ambitious-hbm-roadmaps-at-semicon-korea-2024/
#HBM4 to double speeds in 2026 — 2048-bit interface to revolutionize #AI and #HPC markets
Trendforce reports that HBM4 will significantly depart from traditional standardized DRAM technologies to more customized solutions
HBM4 will mark the first use of a 12nm process wafer for its bottommost logic die, to be supplied by foundries
HBM4 is set to expand from the current 12-layer (12hi) to 16-layer (16hi) stacks, spurring demand for new hybrid bonding techniques
SK hynix & Nvidia reportedly working on a #GPU redesign that 3D-stacks #HBM4 directly on top of the processing cores, eliminating interposers
This resembles AMD's 3D V-Cache, which is placed directly on CPU dies, but HBM will be bigger capacity & cheaper, albeit slower
https://www.tomshardware.com/news/sk-hynix-plans-to-stack-hbm4-directly-on-logic-processors
High Bandwidth Memory (HBM): Samsung bemustert HBM3E in Kürze, bis 2025 kommt HBM4 (Update 1) https://www.computerbase.de/2023-10/high-bandwidth-memory-hbm-samsung-bemustert-hbm3e-in-kuerze-bis-2025-kommt-hbm4/#update-2023-10-19T11:11 #Samsung #HBM4
Nach einigen Gerüchten gibt es nun endlich erste offizielle Informationen #Samsungs zu den kommenden #HBM4-Arbeitsspeichern. https://winfuture.de/news,138986.html?utm_source=Mastodon&utm_medium=ManualStatus&utm_campaign=SocialMedia
#HBM4 in development: Major memory manufacturers behind the spec are planning on starting with an even wider 2048-bit memory interface
Micron: 'HBMNext' set to arrive around 2026 with peak bandwidth of 2+ TB/s per stack
High Bandwidth Memory (HBM): Samsung bemustert HBM3E in Kürze, bis 2025 kommt HBM4 https://www.computerbase.de/2023-10/high-bandwidth-memory-hbm-samsung-bemustert-hbm3e-in-kuerze-bis-2025-kommt-hbm4/ #Samsung #HBM4
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