Thin Chips and Robust Substrates: Fraunhofer Institutes develop key technologies for cost- efficient silicon carbide power electronics in »ThinSiCPower« project. #SiC #WBG #PowerElectronics #MicroElectronics #Semiconductor
https://nachrichten.idw-online.de/2025/02/27/thin-chips-and-robust-substrates-key-technologies-for-cost-efficient-silicon-carbide-power-electronics
